Unveiling planned for Synopsys ARC Processor Summit and Linley Processor Conference 2017
TORONTO, ONATRIO, CANADA, September 21, 2017 /EINPresswire.com/ — Think Silicon, a leader in developing ultra-low power graphics IP technology, has partnered with Synopsys to a create a prototype of an ultra-low power Internet of Things (IoT) platform designed for connected wearable, mobile, and embedded display devices. Think Silicon will unveil the solution at the ARC® Processor Summit 2017, September 26, 2017, at the Santa Clara Marriott, Santa Clara, California, and at the Linley Processor Conference, October 4-5, 2017 at the Hyatt Regency, Santa Clara, California.
The prototype combines the best of Synopsys technology sporting a DesignWare® ARC EM5D Processor with Think Silicon products including NEMA|p, NEMA|DC, and NEMA|GFX-API, resulting in a developer solution aimed at ultra-low power connected wearables and low-power embedded applications. Both companies have tools to assist developers in creating world-class products for a wide variety of markets.
Iakovos Stamoulis, CTO at Think Silicon, will present “Ultra-low Power 3D Micro-GPU for IoT-Class Devices” at the Synopsys ARC Processor Summit on September 26th and at the Linley Processor Conference on October 4. He will address how the emerging IoT market adds design challenges for engineers while discussing how the NEMA Series of ultra-low power micro-GPU cores bridges this gap.
“An increasing number of wearables and other IoT devices are being deployed with displays, requiring designers to find processing solutions with the best balance between graphics performance and power consumption,” said John Koeter, Vice President of Marketing for IP at Synopsys. “By developing an IoT platform that combines Synopsys’ low-power ARC EM5D Processor IP and Think Silicon’s NEMA Series of micro-GPU cores, we help our mutual customers to more rapidly implement high-quality 2D/3D graphics in their connected devices with reduced risk and cost.”
“Think Silicon is proud to partner with Synopsys to create this groundbreaking IoT platform prototype,” said Ulli Mueller, Vice President, Marketing & Business Development of Think Silicon. “We joined forces to build a development platform for graphically rich display applications based on minimal hardware power support. We’re excited to showcase this IoT platform prototype to attendees at both the prestigious Linley Processor Conference and the ARC Processor Summit. These are two unique opportunities to share this new partnership with potential customers and developers with a goal of inspiring developers to create great wearable solutions.”
NEMA|dc contains several smart tools and functions to compose multiple graphics and video layers by improving image quality and helping to reduce the system-on-a-chip (SoC) power consumption. These are backed with support for powerful composition features, a wide range of display interfaces, and advanced proprietary frame-buffer compression technology (TSFBc).
NEMA|p is the smallest member of the NEMA-GPU series and has been specifically designed to serve the need to build economically smart SoCs that drive small yet vibrant display applications.
The NEMA|GFX-API (Application Programming Interface) is designed to accelerate high-quality Graphics User Interface (GUI) development for embedded and wearable devices. The key differentiation from other API offerings is support for ultra-low power functions without the overhead of unnecessary programming instructions for IoT hardware.
For more information about Think Silicon, please visit think-silicon.com
About Think Silicon:
Think Silicon S.A. is a privately held Limited Company founded in 2007, located in Patras, Greece (HQ), Toronto, Canada (Business Development & Marketing office), and San Jose, CA, USA (Sales office). Think Silicon is specialized in developing and licensing high-performance graphics IP technology for ultra-low power and area-limited digital devices for worldwide semiconductor technology customers.
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Source: EIN Presswire